1 csm_EE-SY1200_e_1_1 EE-SY1200 photomicrosensor (reflective) electrical and optical characteristics (ta=25 c ) *1. the letter ?d? indicates the distance between the top surface of the sensor and the sensing object. *2. depends on the installed condition of the photomicrosensor, the detector may receive the sensor's led light and/or the exter nal light which is reflected from surroundings of the phot omicrosensor and /or the background object. please confirm the condition of the phot omicrosensor by actual intended application prior to the mass production use. item symbol value unit condition min. typ. max. emitter forward voltage v f --- 1.2 1.4 v i f = 20 ma reverse current i r --- --- 10 av r = 4 v peak emission wave- length p --- 940 --- nm --- detector light current 1 i l 1 200 --- 1000 a i f = 10 ma, v ce = 2 v, aluminum- deposited surface, d = 4 mm* 1 light current 2 i l 2 150 --- --- a i f = 4 ma, v ce = 2 v, aluminum-de- posited surface, d = 1 mm* 1 dark current i d --- 2 200 na v ce = 10 v, 0 l x leakage current 1 i leak 1 --- --- 500 na i f = 10 ma, v ce = 2 v, with no reflection* 2 leakage current 2 i leak 2 --- --- 200 na i f = 4 ma, v ce = 2 v, with no reflection* 2 collector-emitter satu- rated voltage v ce ( sat ) --- --- --- v --- peak spectral sensitivi- ty wavelength p --- 850 --- nm --- rising time t r --- 30 --- s v cc = 2 v, r l = 1 k , i l = 100 a, d = 1 mm* 1 falling time t f --- 30 --- s v cc = 2 v, r l = 1 k , i l = 100 a, d = 1 mm* 1 dimensions (unit: mm) a k c e emitter center detector center ( 0.7 ) (0.8) (1) ( 0.8 ) 3.2 1.9 1.2 0.7 1.1 ca ek 2-0.65 2-0.45 2-1 2-1.7 2-1 2-0.65 terminal no. name a anode k cathode c collector e emitter internal circuit recommended soldering pattern note 1. the shaded portion in the above figure may cause short- ing. do not wire in this portion. 2. the dimensional tolerance for the recommended soldering pattern is 0.1 mm. note. unless otherwise spec ified tolerances are 0.15. no burrs dimensions are included in out- line dimensions. the burrs dimensions are 0.15 max. diagonal line indicate the region is part au plating area. features ? ultra-compact model. ? pcb surface mounting type. ? high s/n ratio (high light current / low leakage current) absolute maximum ratings (ta=25 c) *1. refer to the temperature rating chart if the ambient tem- perature exceeds 25 c. *2. the pulse width is 10 s maximum with a frequency of 100 hz. *3. complete soldering within 10 seconds for reflow soldering. item symbol rated value unit emitter forward current i f 50 *1 ma pulse forward current i fp 500 *2 ma reverse voltage v r 4v detector collector-emitter voltage v ceo 30 v emitter-collector voltage v eco 5v collector current i c 20 ma collector dissipa- tion p c 50 *1 mw operating temperature topr ? 25 to +85 c storage temperature tstg ? 40 to +100 c reflow soldering temperature tsol 240 *3 c
EE-SY1200 2 engineering data fig 1. forward current vs. collector dissipation temperature rating fig 2. forward current vs. forward voltage characteristics (typical) fig 3. light current vs. forward current characteristics (typical) fig 4. light current vs. collector-emitter voltage characteristics (typical) fig 5. relative light current vs. ambient temperature characteristics (typical) fig 6. dark current vs. ambient temperature characteristics (typical) fig 7. response time vs. load resistance characteristics (typical) fig 8. sensing distance characteristics (typical) fig 9. sensing position characteristics (typical) fig 10. sensing position characteristics (typical) fig 11. response time measurement circuit fig 12. light current measurement setup diagram ambient temperature ta ( c) collector dissipation p c (mw) forward current i f (ma) 60 50 40 30 20 10 0 -20 0 20 40 60 80 100 -40 p c i f forward voltage v f (v) forward current i f (ma) 60 50 40 30 20 10 0 0 ta =+ 70 c ta =+ 25 c ta =- 30 c 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 forward current i f (ma) light current i l ( a) ta = 25 c v ce = 2v d = 1mm v ce = 2v d = 4mm 3,000 2,500 2,000 1,500 1,000 500 0 0 5 10 15 20 collector-emitter voltage v ce (v) light current i l (ma) 1,600 1,400 1,200 1,000 800 600 400 200 0 0246810 i f =2ma, d=4mm i f =4ma, d=4mm i f =2ma, d=1mm i f =7ma, d=4mm i f =4ma, d=1mm i f =10ma, d=4mm i f =15ma, d=4mm i f =7ma, d=1mm i f =10ma, d=1mm ambient temperature ta ( c) relative light current i l (%) 120 110 100 90 80 70 60 -40 -20 0 20 40 60 80 100 i f = 10ma v ce = 2v ambient temperature ta ( c) dark current i d (na) 10,000 1,000 100 10 1 0.1 0.01 0.001 -30 80 010 70 20 40 30 60 -20 -10 50 90 load resistance r l (k ? ) response time tr,tf ( s) 10,000 1,000 100 10 1 0.1 1 10 100 tr tf distance d (mm) relative light current i l (%) d aluminum-deposited surface i f = 4ma, 10ma v ce = 10v 100 90 80 70 60 50 40 30 20 10 0 01 0.5 1.5 2.5 3.5 4.5 2345 card moving distance l (mm) relative light current i l (%) i f = 10ma v ce = 2v d = 4mm i f = 4ma v ce = 2v d = 1mm 0 d l white black + - -4 -3 -5 -6 2 4 3 -1 -2 0 1 120 100 80 60 40 20 0 card movin g distance l (mm) relative light current i l (%) i f= 10ma v ce= 2v d = 4mm i f= 4ma v ce= 2v d = 1mm d l white black 0 + - -4 -3 -5 -6 2 4 3 -1 -2 0 1 120 100 80 60 40 20 0 input output input output 90% 10% t t f t r t 0 v cc r l 0 i l aluminum-deposited surface glass d sensor
3 EE-SY1200 tape and reel reel dimension (unit: mm) tape dimension (unit: mm) part mounting direction the devices are oriented in the rectangular holes in the carrier tape so that the edge with the led faces the round feeding holes. tape quantity 2,000 pcs./reel 21 0.8 13 0.5 2 0.5 15.4 1 13 +1 0 180 0 -3 60 1 0.2 0.4 0.8 0.6 0.2 0.4 0.6 0.8 4 2 4 1.75 5.5 12 1.5 2.15 3.45 1.35 0.3 c a e k pull-out direction 0.2 0.4 0.8 0.6 0.2 0.4 0.6 0.8
EE-SY1200 4 precautions to be taken on mounting temperature profile the reflow soldering can be implemented in two times complying with the following diagram. all the temperatures in the product must be within the diagram. manual soldering the manual soldering cannot be applied to the prod- ucts. there is a possibility that the housing is deformed and/or au plating is peeled off by heat. other notes the use of infrared lamp causes the temperature at the resin to rise particularly too high. all the temperatures in the product must be within the above diagram. do not immerse the resin part into the solder. even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of pcb gives the stress to the product terminals. please confirm the conditions of the reflow soldering fully by actual solder reflow machine prior to the mass production use. storage and handling after opening storage conditions in order to avoid the absorption of moisture, the products shall be stored in a dry box with desiccant or in the following conditions. storage temp. : 5 to 30 c storage humidity : 70%rh or less treatment after opening 1. reflow soldering must be done within 48 hours stored at the conditions of humidity 60%rh or less and temperature 5 to 25 c. 2. in case of long time storage after open, please mount at the conditions of humidity 70%rh or less and temperature 5 to 30 c within 1 week by using dry box or resealing with desiccant in mois- ture-proof bag by sealer. baking before mounting in case that it could not carry out the above treat- ment, it is able to mount by baking treatment. however baking treatment shall be limited only 1 time. recommended conditions : 60 c, 12 to 24 hours (reeled one) 100 c, 8 to 24 hours (loose one) time (sec) temperature (c) 120 sec max. 160c max. 1to 4c/sec 1to 4c/sec 1to 4c/sec 240c max. 10 sec max. 50 sec max. 200c
|
